HY 550 is condensation silicone potting compound in two parts with moderate viscosity.

It can be cured completely at room temperature. HY 550 works on the surface of material as PC(Poly-carbonate)、PP、ABS、PVC as to its superior bonding feature. It is also applicable for waterproof and bonding of electronics parts and operated by manually. It meets the requirements of European RoHS.

Typical Application
- Potting for Protetion of general electronic Module.   

- Outdoor protection for electronic circuit.  

 

 

 

Customers are advised to carry out their own tests on clean, degreased substrates to ensure satisfactory adhesion is achieved. All values are typical and should not be accepted as a specification.

 

(Pls note: all data of this product above tested in 25 „ƒ with 55% humidity conditions. It just for reference and we have no liability of it when testing under different conditions, or data was regenerated)

 

1, Pls put part A and part B in separate container and stir evenly before mixing the two parts together.

2, Weight Ratio: part A: part B = 100:5

3, Bubble release if necessary. Deaeration the mixture under 0.08 MPa for 3 minutes.

4,HY 550 is cured at room temperature, so pls put it under room temperature after pouring. It comes to next process when basically cured, and it takes about 8-12 hours for completely cured. 

Kindly note: Temperature and Humidity with a tremendous influences for curing of HY 550.

l        Warm Tips: